Method of making semiconductor device having buried bias pad

ABSTRACT

A method of making an integrated circuit includes surrounding a first bias pad with dielectric material of a buried oxide layer. The method includes adding dopants to a layer of semiconductor material over the first bias pad. The method includes depositing a gate dielectric and a gate electrode over a top surface of the layer of semiconductor material. The method includes etching the gate dielectric and the gate electrode to isolate a gate electrode over the layer of semiconductor material. The method includes depositing an inter layer dielectric (ILD) material over the gate electrode and the layer of semiconductor material. The method includes etching at least one bias contact opening down to the first bias pad. The method includes filling the at least one bias contact opening with a bias contact material. The method includes electrically connecting at least one bias contact to an interconnect structure of the semiconductor device.

PRIORITY CLAIM

This application claims the priority of China application no.202010644848.3, filed Jul. 7, 2020, and U.S. patent application Ser. No.16/936,030, filed Jul. 22, 2020, which are incorporated herein byreference in their entireties.

BACKGROUND

Breakdown voltage of integrated circuits is related to the thickness ofa buried oxide layer between the transistors of an integrated circuitand the substrate. Increasing the breakdown voltage for transistors ofthe integrated circuit increases the window of operating voltages of theintegrated circuit, and extends the functional life of the integratedcircuit.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a chart of breakdown voltage of an integrated circuit as afunction of substrate voltage, in accordance with some embodiments.

FIG. 1B is a flow diagram of a method of making an integrated circuit,in accordance with some embodiments.

FIG. 2 is a cross-sectional view of an integrated circuit, in accordancewith some embodiments.

FIG. 3 is a cross-sectional view of an integrated circuit, in accordancewith some embodiments.

FIG. 4 is a cross-sectional view of an integrated circuit, in accordancewith some embodiments.

FIG. 5 is a cross-sectional view of an integrated circuit, in accordancewith some embodiments.

FIG. 6A is a top view of an integrated circuit, in accordance with someembodiments.

FIG. 6B is a cross-sectional view of an integrated circuit, inaccordance with some embodiments.

FIG. 7A is a top view of an integrated circuit, in accordance with someembodiments.

FIG. 7B is a cross-sectional view of an integrated circuit, inaccordance with some embodiments.

FIG. 8A is a top view of an integrated circuit, in accordance with someembodiments.

FIG. 8B is a cross-sectional view of an integrated circuit, inaccordance with some embodiments.

FIG. 9 is a cross-sectional view of an integrated circuit, in accordancewith some embodiments.

FIG. 10 is a cross-sectional view of an integrated circuit, inaccordance with some embodiments.

FIGS. 11A-11H are cross-sectional views of an integrated circuit duringa manufacturing process, in accordance with some embodiments.

FIGS. 12A-12D are cross-sectional views of an integrated circuit duringa manufacturing process, in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components, values, operations, materials,arrangements, etc., are described below to simplify the presentdisclosure. These are, of course, merely examples and are not intendedto be limiting. Other components, values, operations, materials,arrangements, etc., are contemplated. For example, the formation of afirst feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Transient or uncontrolled voltage in a substrate below a transistorinfluences a switching speed of the transistor and introduces noise intothe signals generated by an integrated circuit. In some integratedcircuits, switching speed of transistors is further influenced by acircuit structure which regulates a voltage to the substrate to preventvoltage transients, or uncontrolled changes in voltage, in the substratebelow transistors. In some embodiments of the present disclosure,voltage is regulated using a bias pad which is embedded in a buriedoxide layer between a transistor of the integrated circuit and thesubstrate of the integrated circuit. The bias pad is formed by dividinga layer of bias pad material (e.g., a layer of semiconductor material, alayer of metal, or an electrically conductive material) into regionswhich conform to the lateral dimensions of a transistor in an integratedcircuit, a well of a transistor in an integrated circuit, or a cell areaof an integrated circuit having multiple transistors or other circuitelements located therein. A bias pad is electrically connected to theintegrated circuit interconnection structure. In some embodiments, thebias pad is electrically connected to a reference voltage (V_(ss)) of anintegrated circuit. In some embodiments, the bias pad is electricallyconnected to a voltage having a value between the reference voltage andground. A bias pad is connected to the interconnection structure of theintegrated circuit by a bias contact. Bias contacts extend through thelayer of semiconductor material having the doped wells for transistorsource and drain regions, and through part of the buried oxide layer,down to the bias pad. Bias contacts transmit or apply a voltage to thebias pad, and thereby generate or apply a characterized electricalenvironment to the transistor above the bias pad. In some embodiments,the applied voltage is a fixed voltage. In some embodiments, the biaspad is electrically connected to a ground. In some embodiments, both thesubstrate and the bias pad receive applied voltages, as describedherein, to apply a characterized electrical environment to thetransistor above the bias pad. A description of bias contacts, biaspads, and methods of manufacturing bias contacts and bias pads followsbelow.

FIG. 1A is a chart 100 of breakdown voltage of an integrated circuit asa function of substrate voltage, in accordance with some embodiments. Inchart 100, a breakdown voltage trend line 102 for P-type dopedtransistors is plotted against a breakdown voltage trend line 104 forN-type doped transistors. A voltage applied to the substrate is plottedalong the horizontal axis of chart 100, lower values to the left andhigher voltage values to the right of the horizontal axis. Breakdownvoltage of the transistor and integrated circuit is plotted on the Y, orvertical, axis of chart 100, with lower breakdown voltages at the bottomof the vertical axis and higher breakdown voltages at the top of theaxis. In chart 100, the highest point on a breakdown voltage trend lineindicates that the breakdown voltage is greatest, for each of the twotypes of transistors (e.g., P-type, or PMOS, and N-type, or NMOS), atdifferent substrate voltages. In order to increase the overall breakdownvoltage performance of an integrated circuit across the integratedcircuit, the present disclosure describes a structure which includesindividual bias pads within the buried oxide layer for which a biasvoltage (e.g., the applied voltage, similar to the substrate voltage inFIG. 1A) is adjusted on an individual transistor basis. In someembodiments, multiple bias pads are positioned in the buried oxide layerunder different sides of a transistor to individually accommodatedifferent bias voltage breakdown values for N-wells or P-wells in atransistor structure.

FIG. 1B is a flow diagram of a method 140 of making an integratedcircuit, in accordance with some embodiments. Method 140 includes anoperation 142, in which a first oxide layer is deposited over asubstrate for the integrated circuit. Performance of operation 142corresponds to the deposition of first oxide layer 1106 in FIG. 11A, asdescribed below. In some embodiments, the substrate is a semiconductormaterial (e.g., silicon, doped silicon, GaAs, or another semiconductormaterial). In some embodiments, the substrate is a P-doped substrate. Insome embodiments, the substrate is an N-doped substrate. In someembodiments, the substrate is a rigid crystalline material other than asemiconductor material (e.g., diamond, sapphire, aluminum oxide (Al₂O₃),or the like) on which an integrated circuit is manufactured. Inembodiments of substrates which experience leakage current between wellsof transistors or other elements of an integrated circuit, an insulatinglayer (e.g., a buried oxide layer) is deposited over the semiconductormaterial to electrically isolate the substrate from the transistors ofthe integrated circuit. Reducing leakage current by manufacturing aburied oxide layer over a substrate decreases power consumption of theintegrated circuit both during operation of the circuit, and duringperiods when the integrated circuit is idle. In some integratedcircuits, the buried oxide layer is a single layer of insulatingmaterial over the top surface of the substrate. In the presentdisclosure, the buried oxide layer includes at least two layers ofinsulating material deposited in separate insulating material depositionsteps. By depositing the buried oxide layer in two separate insulatingmaterial deposition steps, a layer of electrically conductive material(e.g., bias pad material) is deposited over a first oxide layer andunder a second oxide layer (see below, operation 150). The first oxidelayer electrically isolated the bias pad material (or, the bias padafter manufacturing, see operation 158, manufacture of isolationstructures, below) from the substrate and other components of theintegrated circuit.

According to some embodiments, the first oxide layer is a layer ofsilicon dioxide (SiO₂). In some embodiments, the first oxide layer is alayer of inorganic nitride over the substrate (e.g., silicon nitride(Si_(x)N_(y)), or the like). In some embodiments, the first oxide layeris deposited over a top surface of the substrate. In some embodiments,the first oxide layer is deposited by chemical vapor deposition (CVD)by, e.g., a combination of argon (Ar), silane (SiH₄), and oxygen (O₂) orwater (H₂O), over the top surface of the substrate. CVD-deposited oxidesare free from dopants unless deliberately included in the dopantreaction gas mixture used to form the CVD-deposited oxide. In someembodiments, the first oxide layer is grown from the top surface of thesubstrate by, e.g., rapid thermal processing (RTP). In some embodiments,RTP growth of a first oxide layer includes processing a substrate ofsemiconductor material in an ambient atmosphere which includes one ormore of argon, oxygen, or water vapor at temperatures greater than 300degrees Celsius (° C.). Oxide growth by RTP forms a dense and uniformoxide layer to electrically isolate the substrate from bias pads and theintegrated circuit. RTP-grown oxide layers include dopants found in theupper region of the substrate near the top surface because the substratematerial (semiconductor material, e.g., silicon, doped silicon, GaAs, orthe like) is incorporated into the RTP-grown oxide. In some embodiments,a first oxide layer is formed on a top surface of the integrated circuitby depositing and curing a liquid material to form an oxide such asspin-on glass (SOG), BPSG (boron phosphorous spin-on glass), or FSG(fluorinated silica glass).

In some embodiments, the first oxide layer has a thickness ranging fromabout 50 Angstroms (Å) to about 50 nanometers (nm), although otherthicknesses are also within the scope of the present disclosure. A firstoxide layer having a thickness less than about 50 Angstroms does notprovide sufficient electrical insulating capacity or coverage based onsome methods of growing or depositing oxide on the layer ofsemiconductor material. Incomplete coverage for thin first oxide layersresults in leakage current into the substrate. First oxide layers havingfilm thicknesses of about 50 nm are achieved by depositing (via, e.g., aform of chemical vapor deposition, physical vapor deposition (PVD), orthe like) an insulator material onto the substrate having good coverageand good insulating characteristics to reduce and/or eliminate leakagecurrent from transistor wells into the substrate.

Method 140 includes an optional operation 144, in which a portion of thefirst oxide layer is modified to have a reduced thickness as compared toa thickness of the first oxide layer upon completion of operation 142.Performance of operation 142 corresponds to a thinning of the firstoxide layer 1106 deposited in operation 140, as described above. In someembodiments, performance of operation 142 is performed on, e.g., firsttransistor 1103A and not on second transistor 1103B, or vice versa.Embodiments of method 140 wherein the electrical environment applied tothe transistors is homogeneous across the integrated circuit, or acrossa semiconductor substrate (or, a semiconductor wafer) during amanufacturing process, omit optional operation 144 because the thicknessof the first oxide layer, the bias pad, and the second oxide layer (seebelow) over the top of the bias pad, are similar across the integratedcircuit or semiconductor substrate. Embodiments of method 140 whereinthe electrical environment applied to the transistors is heterogeneousacross the integrated circuit, or across the semiconductor substrate,include one or more film thickness modifying operations such asoperation 144, operation 148, and/or operation 152, described below.According to some embodiments, the thickness of the first oxide layerafter optional operation 144 is not less than 100 Angstroms to avoidbreakdown of the first oxide layer when a voltage is applied to a biaspad and to a substrate below the bias pad. In some embodiments, thesubstrate and the bias pad are applied voltages with opposite signs(e.g., positive to the bias pad, and negative to the substrate) whichcauses breakdown of the first oxide layer when too thin.

In some embodiments, the first oxide is thinned below an entiretransistor in a cell of the integrated circuit, while below anothertransistor in the same cell has no modification of the first oxidethickness. In some embodiments, the first oxide is thinned below onewell of a transistor, while the first oxide below a different well ofthe transistor has no modification of the first oxide thickness. In someembodiments, the thinned portion of the first oxide layer and theunmodified portion of the first oxide layer intersect below thetransistor, and are separated by formation of an isolation structure.

Method 140 includes an operation 146, in which a layer of bias padmaterial is deposited over the first oxide layer. Performance ofoperation 146 corresponds to the deposition of the layer of bias padmaterial 1108, as shown in FIG. 11A, below. As described above, thelayer of bias pad material comprises an electrically conductivematerial. In some embodiments, the electrically conductive material is ametal film. In some embodiments, the metal film includes tungsten,cobalt, titanium, tantalum, nickel, alloys thereof, or the like.According to some embodiments, the metal film used for a layer of biaspad material is a same material forming bias contacts from a bias padthrough the layer of semiconductor material and the upper portion of theburied oxide layer. According to some embodiments, the layer of bias padmaterial is a semiconductor material. In some embodiments, thesemiconductor material is polysilicon. In some embodiments, thesemiconductor material is a type III-V semiconductor material such asgallium arsenide (GaAs), or the like.

In embodiments of method 140 where the layer of bias pad material is ametal film, the metal film is deposited by, e.g., sputtering the layerof material from a target over the top surface of the first oxide layer.Embodiments of method 140 where the layer of bias pad material is asemiconductor material, the semiconductor material is deposited by,e.g., atomic layer deposition (ALD), chemical vapor deposition (CVD), orthe like. According to some embodiments, the bias pad material is a pure(undoped) semiconductor material. According to some embodiments, thebias pad material is doped during deposition. According to someembodiments, the bias pad material is a semiconductor material on whicha metal silane layer is grown by depositing metal atoms on a layer ofsemiconductor material and annealing to interdiffuse the metal andsilicon (or other semiconductor material) atoms. According to someembodiments, a metal silane layer is able to transmit the voltageapplied to the bias pad across the bias pad, and therefore generate adesired electrical environment below a transistor more quickly than anundoped or a lightly doped semiconductor material for the bias pad.

According to some embodiments, the layer of bias pad material has athickness ranging from about 10 nm to about 100 nm, although otherthicknesses are also within the scope of the present disclosure. Biaspad material having a thickness less than about 10 nm are prone toincomplete coverage over the first oxide layer, resulting in an unevenelectrical field below a layer of semiconductor material havingtransistor wells therein. Layers of bias pad material having thicknessesgreater than about 100 nm do not provide increased benefit in terms ofapplied electrical field to the layer of semiconductor material.However, with increased thickness of the layer of bias pad material(e.g., at greater than 100 nm), the filling of isolation structuresextending through the layer of bias pad material becomes more difficultand sometimes results in voids or gaps in the isolation structurematerial.

Method 140 includes an optional operation 148, in which a portion of thebias layer material is modified. Performance of optional operation 148adjusts the thickness of layer of bias pad material 1108 as shown inFIG. 11A, below. In some embodiments, performance of optional operation148 thins bias pad material for one transistor (e.g., first transistor1103A, or second transistor 1103B, as shown in FIG. 11B). In someembodiments, performance of optional operation 148 thins bias padmaterial for multiple adjacent transistors (e.g., both first transistor1103A and second transistor 1103B, as shown in FIG. 11B, below). In someembodiments, the modification is to reduce the thickness of a portion ofthe layer of bias pad material. In some embodiments, the modification isto form isolated bias pads from the layer of bias pad material beforedeposition of the second oxide layer (see below, operation 150). In someembodiments, the modification includes both reducing a thickness of aportion of the layer of bias pad material and forming isolated bias padsfrom the layer of bias pad material.

In some embodiments of the present disclosure, electrical propertiesbelow wells of the transistor are modified by changing a thickness ofthe bias pad layer, rather than decreasing the thickness of a portion ofthe buried oxide. According to some embodiments, a thickness of thelayer of bias pad material is modified by applying a layer of patterningmaterial over a top surface of the layer of bias pad material andtransferring a pattern to the layer of patterning material. According tosome embodiments, the layer of patterning material is a photoresistlayer. According to some embodiments, the patterning material is able tobe patterned using electron beams or extreme ultraviolet (EUV)lithography. In some embodiments, the pattern applied to the layer ofpatterning material includes pattern corresponding to openings in thelayer of patterning material corresponding to locations where the layerof bias pad material is to be thinned.

Thinning the layer of bias pad material occurs by etching. In someembodiments, the layer of bias pad material is thinned by performing adry or plasma etch process to anisotropically remove an exposed portionof the bias pad material while leaving a covered portion of the bias padmaterial unmodified. Dry etch or plasma etch processes configured toremove metal or metallic bias pad materials include halogenatedreactants such as hydrochloric acid (HCl), hydrofluoric acid (HF),hydrogen bromide (HBr), chlorine (Cl₂), fluorine (F₂), or the like.

Dry etch or plasma etch processes which are anisotropic have a morevertical profile than isotropic etch processes, preserving thedimensions of the bias pad material below the layer of patterningmaterial and avoiding undercut of the layer of patterning material.Undercuts lead to a greater number of voids in an integrated circuitduring the manufacturing process. In some embodiments, undercuts becomesufficiently pronounced to impact electrical connections between biaspads and bias contacts to the bias pad.

In some embodiments, thinning the layer of bias pad material isperformed using wet etchants. According to some embodiments, wetetchants provide greater uniformity of removal during the thinningprocess. In some embodiments, undercut of the layer of patterningmaterial during thinning of the layer of bias pad material iscompensated for by modifying (shrinking) the dimensions of the openingin the layer of patterning material to make the opening smaller. In someembodiments, undercut of the layer of patterning material by isotropicetch during a wet etch thinning process is deliberately incorporated toachieve a desired dimension of the thinned bias pad, or the recess intothe layer of bias pad material (e.g., prior to forming isolationstructures through the layer of bias pad material).

In some embodiments, wet etchants are used for large openings in thelayer of patterning material or for large thinned areas, because the wetetchant is less prone to leave residues of the thinning process on a topsurface of the layer of patterning material. In embodiments where thelayer of bias pad material is a metal or a metallic material, wetetching reduces a likelihood of metal residue contaminating theintegrated circuit.

In some embodiments of the method, the modification is to form isolatedbias pads from the layer of bias pad material before deposition of thesecond oxide layer (see below, operation 150). Separation of the layerof bias pad material into individual bias pads is performed in order toavoid damage to a circuit component (e.g., a transistor, such as inintegrated circuit 1000 of FIG. 10, below) when the integrated circuitdesign places an isolation structure in proximity to a circuit elementprone to damage, or which partially or completely masks or blocks theisolation feature between individual bias pads of an integrated circuit.In integrated circuit 1000, deep trench isolation structure (DTI) 1022Aand DTI 1022C are separated from the transistor (or, from wells 1012A,1012B, and 1012C), and extend through layer of semiconductor material1012 and second oxide layer 1010 to first oxide layer 1006. However, DTI1022B is directly below the gate electrode 1014G and only extends fromsecond oxide layer 1010 to first oxide layer 1006. Because it is notpossible to form DTI 1022B without disrupting the layer of semiconductormaterial 1012 in the transistor region, the layer of bias pad materialis divided into individual pads before depositing the second oxide layer(see operation 150, below) or depositing the layer of semiconductor ofmaterial (see operation 154, below).

Method 140 includes an operation 150, in which a second oxide layer isdeposited over the bias layer material. Performance of operation 150corresponds to the deposition of second oxide layer 1110 as shown inFIG. 11A, below. The second oxide layer is deposited over the bias padmaterial by, e.g., a chemical vapor deposition (CVD) process such aslow-pressure CVD (LPCVD), plasma-enhanced CVD (PECVD), or the like. Thesecond oxide layer is not grown, as is sometimes the case with the firstoxide layer, because the layer of bias pad material is not always asemiconductor material. The second oxide layer has a thickness rangingfrom about 10 nm to about 100 nm, although other thicknesses are alsowithin the scope of the present disclosure. The second oxide layer isthe layer of the buried oxide which is in direct contact with the layerof semiconductor material (see operation 154, below) which contains thewells of transistors for the integrated circuit. The second oxide layeris sufficiently thick that the potential between the bias plate and thewells of transistors shields the wells of transistors, and the channelregions of transistors, from transient or uncontrolled voltages in thesubstrate, while not suppressing carrier movement or inducing breakdownof the second oxide layer. Thicknesses of the second oxide layer smallerthan about 10 nm are prone to breakdown, whereas thicknesses greaterthan about 100 nm are more likely to contribute to problems filling DTIsextending through the second oxide layer, and problems filling theopenings for bias contacts and substrate contacts formed in operation164, below.

Method 140 includes an optional operation 152, in which the thickness ofthe second oxide layer is modified, according to some embodiments.Performance of optional operation 152 corresponds to reducing thethickness of a second oxide layer (see second oxide layer 1110) as shownin FIG. 11A, below, prior to deposition of layer of semiconductormaterial 1112 in an operation 154, described below. In some embodiments,the second oxide layer has an uneven top surface because modificationsto the thickness of the layer of bias pad material and/or the firstoxide layer are transferred through the second oxide layer. In someembodiments, a chemical mechanical polishing (CMP) step is performed inoptional operation 152 to flatten the top surface of a second oxidelayer (and, incidentally thin, in some regions the second oxide layerover the “thick” portions of the first oxide layer or the layer of biaspad material). Optional operation 152 is performed when an uneven topsurface of the second oxide layer further translates to an uneven topsurface of the layer of semiconductor material having wells of theintegrated circuit. An uneven surface of the layer of semiconductormaterial is more likely to result in uneven switching speeds, orunpredictable channel lengths because the top surface of the layer ofsemiconductor material is not uniformly flat, but textured according tounderlying layers.

Method 140 includes an operation 154, in which a layer of semiconductormaterial is deposited over the second oxide layer. Performance ofoperation 154 corresponds to the deposition of a layer of semiconductormaterial such as layer of semiconductor material 1112 as described inFIG. 11A, et seq. below. In some embodiments, the layer of semiconductormaterial includes, e.g., pure silicon, doped silicon, silicon germanium(SiGe), or a type III-V semiconductor such as gallium arsenide (GaAs).In some embodiments, the layer of semiconductor material is deposited byatomic layer deposition or chemical vapor deposition (CVD) of thesemiconductor material using, e.g., silane gas. In some embodiments, thelayer of semiconductor is formed by depositing a silicon layer, followedby deposition of a dopant rich semiconductor material, and thermallyprocessing the films to inter-diffuse the dopants and the silicon toform a dopant rich region at a top surface of the integrated circuit forthe source, drain, and channel of a transistor.

Method 140 includes an operation 156, in which dopants are added to thelayer of semiconductor material, in accordance with some embodiments. Insome embodiments, dopants are added to the layer of semiconductormaterial to form N-wells, P-wells, and drift regions for channels of thetransistors of the integrated circuit. In a non-limiting example,dopants are added to an N-well such as N-well 1112C in first transistor1103A, or to N-well 1112D in second transistor 1103B. In a non-limitingexample, dopants are added to a P-well such as P-well 1112A in firsttransistor 1103A or P-well 1112F in second transistor 1103B. In someembodiments, dopants are added to the layer of semiconductor materialby, e.g., applying a layer of patterning material to mask portions ofthe layer of semiconductor material that are to remain undoped (e.g.,regions outside the source, drain, or HVNW (high voltage N-wells) of theintegrated circuit), transferring a pattern to the layer of patteringmaterial to expose portions of the layer of semiconductor which are toreceive dopants, and implanting the dopants from an ion source implanttool. In some embodiments, the steps of depositing the layer ofpatterning material, transferring a pattern to the layer of patterningmaterial, and adding dopants by an ion source implant tool are performedseparately for each doped region in the layer of semiconductor material.In some embodiments, some doped regions are added to the layer ofsemiconductor material with a same layer of patterning material, butwith the substrate held at a different slant or tilt to direct implanteddopants to different areas of the exposed regions of the layer ofsemiconductor material. In some embodiments, the dopants are added toform N-wells for a source or drain of transistors. In some embodiments,the dopants are added to form P-wells of a drain or source of thetransistors. In some embodiments, N-type dopants are added to form HVNW(high voltage N-wells) between transistor wells in the layer ofsemiconductor material. In some embodiments, the dopants are added at alow implant energy to form lightly doped regions (LDD regions) at a topsurface of the transistor wells directly below contacts for thetransistor source or the transistor drain. LDD regions at a top surfaceof a well for a transistor increase the carrier density, reducing thepotential needed to switch the transistor to an “on” or active state,and decreasing the current (I_(on)) through the transistor duringoperation. In some embodiments, dopants are implanted into an LDD regionsuch as LDD region 1115A in P-well 1112A as described in FIG. 11F.

Method 140 includes an operation 158, in which isolation structures forthe integrated circuit are manufactured. Openings for isolationstructures (see elements 1121A and 1121B of FIG. 11B) are etched throughsome of the films deposited over the substrate (see element 1102), asdescribed below. Some openings 1121B are for shallow isolationstructures (see elements 1122B, 1122D of FIG. 11C) and some openings1121A are for deep trench isolation structures (see elements 1120A,1120C, 1120F of FIG. 11C). Deep trench isolation structures (DTI),mentioned above, are isolation structures which extend through the layerof semiconductor material, the second oxide layer, the layer of bias padmaterial, and into the first oxide layer. In some embodiments, DTIextend through the first oxide layer and into the substrate below thefirst oxide layer. In some embodiments, DTI correspond to locations ofcell boundaries in the integrated circuit. In some embodiments, DTIcorrespond to isolation walls around an isolation region of the layer ofsemiconductor (a region where the bias contacts extend through the layerof semiconductor material, and which electrically isolate the transistorwells from the bias contacts, or from the semiconductor material indirect contact with the bias contacts extending through the isolationregions). In some embodiments, DTI electrically isolate bias pads in onecell, having a first voltage, from bias pads in a second (adjoining)cell, having a second voltage. In some embodiments, DTI electricallyisolate a bias pad below one transistor in a cell, from a second biaspad below a second transistor in the same cell, such that each bias padhas a different voltage than another bias pad in the same cell. In someembodiments, DTI electrically isolate multiple bias pads below a singletransistor, and are manufactured before deposition of the layer ofsemiconductor material.

Shallow trench isolation structures (STI) are formed at a top part ofthe layer of semiconductor material and extend part way, but notcompletely, through the layer of semiconductor material. STI are used inan integrated circuit to increase the separation between electricallyconductive materials such as a source contact and a gate electrode overa channel of the transistor. STI are aligned with DTI in the cell of anintegrated circuit.

An STI or a DTI is manufactured by depositing a layer of patterningmaterial (photoresist, EUV resist, e-beam masking materials) over a topsurface of the stack of films at a given stage of the integrated circuitmanufacturing process, transferring a pattern to the layer of patterningmaterial, and forming, within openings in the layer of patterningmaterial, the isolation structures (STI or DTI). In some embodiments, anopening for the isolation structure is formed in the stack of films byetching the stack of films with a dry or plasma etch process. Thechemistry of the etch plasma varies according to the material(s) beingetched as the opening deepens. In some embodiments, insulatingmaterials, such as silicon dioxide, for the buried oxide layer includefluorocarbons such as CF₄, trifluoromethane (CHF₃), difluoromethane(CH₂F₂), and gaseous HF. In some embodiments, oxygen is included in theetch plasma to remove polymer buildup during the etching process. Acarrier gas such as argon is used adjust the total concentration ofchemically-active etchant molecules during dissociation and etching tobalance polymer formation on the integrated circuit surface and controlthe profile of the isolation structure openings. Isolation structureopenings are formed with anisotropic etch processes (e.g., highdirectionality, associated with strong bombardment energies or largeacceleration voltages) to maintain straight isolation structuresidewalls and reduce the likelihood of voids or pockets in the isolationstructure filling materials.

In some embodiments, DTI are manufactured in the cell before STI aremanufactured. In some embodiments, DTI and STI are manufactured afterdeposition of the layer of semiconductor material and the formation oftransistor wells in the layer of semiconductor material. In someembodiments, a manufacturing process includes multiple iterations ofmanufacturing STI and DTI in order to generate bias pads for transistorsand to accommodate variations in transistor designs having bias padsassociated therewith.

Method 140 includes an operation 160, in which a gate electrode ismanufactured over the layer of semiconductor material, in accordancewith some embodiments. A non-limiting example of a gate electrode isdepicted in FIG. 11E, where elements 1114G1 and 1114G2 overlay driftregions and wells of the first transistor and the second transistor ofthe integrated circuit 1100. In operation 160, as part of making a gateelectrode such as gate electrodes 1114G1 and 1114G2 of FIG. 11E, a thingate oxide layer is deposited over a top surface of the layer ofsemiconductor material to electrically isolate the channel region, belowthe gate oxide layer, and between the source well and the drain well,from the gate electrode. In some embodiments, the gate oxide is a layerof silicon dioxide (dielectric constant κ of about 3.7 to 3.9). In someembodiments, the gate oxide comprises hafnium dioxide (HfO₂, dielectricconstant κ>12). In some embodiments, the gate oxide is a high-kdielectric (κ>3.9) other than hafnium dioxide (e.g., ZrO₂, and soforth).

In some embodiments, the gate electrode is manufactured by a dummy gatemanufacturing process, wherein a blanket layer of a first inter layerdielectric (ILD) material is deposited over the gate oxide layer overthe layer of semiconductor material, an opening is formed in the firstILD material to expose a portion of the gate oxide layer, and aplurality of liner materials, and a dummy gate material, are depositedinto the opening. In some embodiments of dummy gate manufacturingprocesses, the dummy gate material is removed and filled with a gateelectrode material before forming contacts to the source well (sourceregion) and the drain well (drain region) of the transistor. In someembodiments of dummy gate manufacturing processes, the dummy gatematerial is removed and filled with gate electrode material afterforming source and drain contacts through the first ILD material.

In some embodiments, a blanket layer of gate electrode material isdeposited over the gate oxide layer, a layer of patterning material isdeposited over the gate electrode material and patterned with remaininglines or remaining features corresponding to locations of gateelectrodes over the channels of transistors in the integrated circuit.In some embodiments, the layer of gate electrode material is etched toremove unprotected gate electrode material and unprotected gate oxidematerial and to expose the layer of semiconductor material havingtransistor wells (source, drain, HVNW, and so forth) therein. In someembodiments, one or more spacer layers are deposited over the gateelectrode stack (the remaining portion of gate electrode material andremaining portion of the gate oxide), and etched back to leave aremaining portion of the spacer layers at the sides of the remainingportion of gate electrode material and the remaining portion of the gateoxide.

In some embodiments, the gate electrode is part of a fin field effecttransistor (FinFET) and the gate electrode extends continuously over atop and sides of a fin of dielectric material having therein the sourcewell, the drain well, and the channel. In some embodiments, the finfield effect transistor includes multiple fins made from the layer ofdielectric material, the fins being separated from each other by aninsulating material such as the first ILD described hereinabove inreference to the dummy gate manufacturing process. In some embodiments,the gate electrode is a line of material separated from a flat or planarlayer of semiconductor material by the remaining portion of the gatedielectric layer.

Method 140 includes an operation 162, in which an interlayer dielectric(ILD) film is deposited over the gate electrode and the wells of theintegrated circuit. Deposition of an ILD film over a gate electrode andwells of the integrated circuit corresponds to deposition of the ILDfilm. In some embodiments, the ILD film includes at least one insulatingmaterial such a silicon dioxide, spin on glass, boron phosphorous silicaglass, or some other dielectric or insulating material with a dielectricconstant κ of about 4. In some embodiments, the ILD film is a low-κdielectric material with a dielectric constant κ of less than about 2.5,such as SICOH®, Black Diamond®, SiLK®, and so forth. In someembodiments, ILD films are deposited by a variant of a CVD process, suchas PECVD (plasma enhanced CVD), LPCVD (low pressure CVD), LACVD (laserassisted CVD), and the like. In some embodiments, an ILD film is formedby depositing a liquid material over the top of the wafer or substrate,spinning the wafer or substrate to produce a reduction in film thicknessof the liquid material, and curing the liquid material to trigger, e.g.,cross-linking of within the ILD film, or polymerization of the liquidmaterial, or to produce a degassing effect as a solvent or liquidcomponent evaporates while a solid material remains behind to form theILD film.

Method 140 includes an operation 164, wherein contacts are manufacturedthrough the ILD. A non-limiting example of manufacture of contactsthrough the ILD is described in FIG. 11G, where contacts 1118A-1118C aremanufactured down to bias pads 1108A-1108C, drain contact 1116D1 ismanufactured down to drain well 1112A, source contact 1116S1 ismanufactured down to N-well 1112C, and gate contact 1116G1 ismanufactured to gate electrode 1114G1. Transistors are formed indifferent groups in order to facilitate the profile control andselectivity of the etch process with respect to the material at thebottom, or on the sides, of the contact opening during the contactopening etch process. Etching contacts involves a step of depositing alayer of patterning material over a top surface of the ILD filmdeposited in operation 162. Etching contacts further involves a step oftransferring a pattern to the layer of patterning material, withopenings in the patterning material corresponding to positions ofcontact in the material(s) being etched. Etching contacts furtherinvolves at least one etch step, wherein the material exposed at thebottom of openings in the patterning material are removed by liquid orplasma-type etchants to expose underlying material for a predeterminedamount of time, or until a particular material or film is exposed at thebottom of the etched opening.

In some embodiments, the contacts are transistor contacts, which makeelectrical connection to a source well, a drain well, or a gateelectrode of a transistor in the semiconductor device. In someembodiments, the contacts are bias contacts, which extend from a topsurface of the first ILD film down to a bias pad embedded within theburied oxide layer or sandwiched between the first oxide layer and thesecond oxide layer, and surrounded within the buried oxide layer by adeep trench isolation structure which loops around the bias pad. In someembodiments, the contacts are substrate contacts, which extend from atop surface of a first ILD film down to the substrate. In someembodiments, the substrate contacts intersect and electrically connectwith a bias pad in the buried oxide layer. In some embodiments, thesubstrate contacts are separated from the bias pads and the biascontacts in the buried oxide layer.

Contacts are filled with a metal or metallic compound, such as tungsten,cobalt, nickel, titanium, tantalum, or the like, and alloys thereof.Contacts are filled by sputtering the metal or metallic compound, or byatomic layer deposition of metallic compounds over exposed sidewalls andthe bottom of the contact opening, and allowing the metallic compound togrow and fill the contact opening. Subsequent to filling the contactopening, a chemical mechanical polishing step is performed to removecontact metals from a top surface of the first ILD film and isolate thetop ends of the contacts from each other. In some embodiments, etchprocesses to form contact openings are performed sequentially to make,e.g., shallow contacts such as transistor contacts, separately fromdeeper contacts, such as bias contacts and substrate contacts.

Method 100 includes an operation 166, wherein the transistor contactsare connected to an interconnect structure of the integrated circuit,according to some embodiments. In some embodiments, the transistorcontacts electrically connect to other contacts or vias in theinterconnection structure. In some embodiments, the transistor contactselectrically connect to conductive lines in an ILD layer over the layerof dielectric material which contains the transistor contacts. In anon-limiting example described in FIG. 11H, conductive line 1124Aelectrically connects bias contact 1118B and drain contact 1116D1, andconductive line 1124B electrically connects source contact 1116S2 tobias contact 1118C, and conductive lines 1124A and 1124B are within ILDlayer 1119.

According to some embodiments, the operations described hereinabove areperformed in a different order than the order presented above. In someembodiments, the operations described hereinabove are performed withadditional operations intermixed therein. In some embodiments, some ofthe operations described above are omitted from the method while stillproducing the structures described hereinbelow. Such variations in themethod described above do not limit the scope of the present disclosureand should be understood by a person skilled in the art as naturalvariations which occur in, but do not detract from, the scope of thedisclosure with respect to making variations on the structures disclosedherein.

FIG. 2 is a cross-sectional view of integrated circuit 200, inaccordance with some embodiments. Integrated circuit 200 includes asubstrate 204 wherein a first cell 201A of the integrated circuitadjoins a second cell 201B. A cell boundary 202 indicates a transitionpoint between first cell 201A and second cell 201B. In some embodiments,first cell 201A is a high-voltage cell and second cell 201B is alow-voltage cell. A first oxide layer 206 has been deposited on a topsurface of substrate 204. A layer of bias pad material 208 is over thefirst oxide layer 206. The layer of bias pad material 208 has beendivided into individual bias pads 208A, 208B, 208C, and 208D. Bias pad208A is in second cell 201B. Bias pads 208B, 208C, and 208D are in thefirst cell 201A. The individual bias pads are separated by trenchisolation structures (DTI), described below.

A second oxide layer 210 is over the top surface of the individual biaspads 208A-208D. A layer of semiconductor material 212 is over the secondoxide layer 210. The layer of semiconductor material 212 includes aplurality of wells for transistors of the integrated circuit 200. Afirst transistor 203A is a PMOS device, wherein the source well 212C isan N-doped well 212C, the drain well 212A is a P-doped well, and thechannel region includes a P-drift region 212B. In first transistor 203A,the source well 212C includes two LDD regions 215B and 215C. LDD region215B has a net P-type doping profile and LDD region 215C has aconcentration of N-type dopants greater than the concentration of N-typedopants in well 212C. Drain well 212A includes a P-type doped LDD region215A. The inclusion of LDD regions in the source well 212C and the drainwell 212A promotes increased carrier density at the boundary between theLDD regions and the wells wherein the LDD regions are located. Theinclusion of P-type doped LDD region 215B in source well 212C promoteshigh carrier concentration adjacent to the channel region directly belowgate electrode 214G1.

A second transistor 203B is an NMOS device, having a P-doped source well212F, and N-type doped drain well 212D and a channel region whichincludes an N-type doped drift region 212E between the source well 212Fand the drain well 212D. Second transistor 203B includes LDD regions215D in the drain well 212D, LDD region 215E in the P-doped source well212F and LDD region 215F in the source well 212F. LDD region 215F has ahigher concentration of P-type dopants then is found in P-doped well212F. LDD region 215E has a net N-type dopant concentration. LDD region215E in source well 212F generates a high carrier concentration at theP/N junction where LDD region 215E meets LDD region 215F and P-dopedsource well 212E. The high carrier concentration in the source well 212Fat the P/N junction enhances the ability of the second transistor 203Bto switch on quickly.

Shallow trench isolation structures (STI) extend partway through thelayer of semiconductor material 212. Deep trench isolation structures(DTI) extend entirely through the layer of semiconductor material 212.Some deep trench isolation structures further extend through the secondoxide layer 210 and the layer of bias pad material 208 to createindividual bias pads 208A-208D.

First interlayer dielectric (ILD) film 214 is over the top surface ofthe layer of semiconductor material 212. As described above in method140, the first ILD film 214 electrically isolates transistors in firstcell 201A from transistors in second cell 201B and, within eachtransistor, the source, the drain, and gate electrode, and the contactselectrically connected thereto from each other. In integrated circuit200, two different types of contacts extend through first ILD film 214.Bias contacts 218A, 218B, and 218C, extend through first ILD film 214,the layer of semiconductor material 212, and the second oxide layer 210,to electrically connect with individual bias pads. Bias contact 218Aelectrically connects with bias pad 218A in second cell 201B. Biascontact 218B electrically connects with bias pad 208B in first cell201A. Bias contact 218C electrically connects with bias pad 208C infirst cell 201A. Bias contacts conduct an electrical potential from theinterconnection structure of an integrated circuit 200 down to the biaspads below transistors in order to modify the electrical environmentaround the source wells and channel regions of transistors in anintegrated circuit. In integrated circuit 200, bias pad 208A, bias pad208B, and bias pad 208C are configured to modify the electricalenvironments below single transistors. In some embodiments, each biascontact conducts a different electrical potential to the bias pad towhich the bias contact is connected. In some embodiments, the individualbias contacts conduct the same electrical potential to the bias pads towhich they are connected.

Bias contact 218A extends through first ILD film 214, layer ofsemiconductor material 212, and second oxide layer 210, and down to biaspad 208A. In some embodiments, bias contact is against a top surface ofbias pad 208A. In some embodiments, bias contact 218A extends down intobias pad 208A. Bias contact 218A is laterally separated from STI 220Aand STI 220B.

In a similar fashion, bias contact 218B and bias contact 218C extendthrough first ILD film 214, layer of semiconductor material 212, andsecond oxide layer 210 down to bias pads. Bias contact 218B is laterallyseparated from STI 220B and STI 220C. Bias contact 218C is laterallyseparated from STI 220G and STI 220H.

Integrated circuit 200 includes transistor contacts which extend throughfirst ILD film 214 down to the source, drain, and electrode of eachtransistor. For example, in the first transistor 203A, source contact216S1 extends through first ILD film 214 down to a top surface of N-well212C, making connections with LDD regions 215B and 215C at a top end ofN-well 212C. Drain contact 216D1 extends through ILD film 214 down toLDD region 215A at a top end of drain well 212A. Gate contact 216G1extends through first ILD film down to a top surface of gate electrode214G1. Gate electrode 214G1 is against a top surface of N-well 212C, atop surface of drift region 212B, and a top surface of STI 220D. STI220D separates gate electrode 214G1 from P-doped drain well 212A andfrom P-doped LDD region 215A at a top end of drain well 212A.

Transistor contacts in second transistor 203B are as follows. Draincontact 216D2 extends through first ILD film 214 down to LDD region 215Dat a top end of N-well 212D. Source contact 216S2 extends through firstILD film 214 down to LDD regions 215E and 215F at the top end of sourcewell 212F. Gate contact 216G2 extends through first ILD film down to atop surface of gate electrode 214G2. Gate electrode 214G2 extends acrossa top surface of STI 220F, N-doped drift region 212 and source well212F. According to some embodiments, the gate electrode extends over atop surface of the LDD region in the source well.

FIG. 3 is a cross-sectional view of an integrated circuit 300, inaccordance with some embodiments. The elements of integrated circuit 300which match structure and function of the elements described above forintegrated circuit 200 are given a same identifying reference numeralincremented by 100. Differences between integrated circuit 300 andintegrated circuit 200 are described herein below.

In integrated circuit 300, second cell 301B includes bias contact 318Awhich extends through first ILD film 314, layer of semiconductormaterial 312, and second oxide layer 310 down to bias pad 308A. Biascontact 318A is laterally separated from STI 320A and STI 320B. In firstcell 301A, bias contacts 318B and 318C are at different positions frombias contacts 218B and 218C in integrated circuit 200. Bias contact 318Bextends through first ILD film 314, STI 320C, DTI 322C, and second oxidelayer 310 before reaching bias pad 308B. Similarly, bias contact 318Cextends through first ILD film 314, layer of semiconductor material 312,second oxide layer 310, before reaching bias pad 308C. Bias contacts318B and bias contact 318C represent bias contacts electrically isolatedfrom semiconductor material of the layer of semiconductor material 312.According to some embodiments of the present disclosure, the biascontacts extending through the layer of semiconductor material areisolated from the transistors within isolation regions of the layer ofsemiconductor material. See, e.g., isolation regions 227A and 227B inintegrated circuit 200. In some embodiments, such as integrated circuit300, bias contacts are electrically isolated from transistors of anintegrated circuit by positioning the bias contacts such that theyextend through isolation structures and are laterally separated fromsemiconductor material by the surrounding insulating material of deeptrench isolation structures. According to some embodiments, amanufacturer selects to position bias contacts within deep trenchisolation structures in order to save space within the integratedcircuit by eliminating isolation regions (see, isolation region 227B inintegrated circuit 200) to reduce the die area of an integrated circuit.According to some embodiments, each bias contact in a cell of anintegrated circuit is positioned within and extending through deeptrench isolation structures. According to some embodiments, some biascontacts in a cell extend through deep trench isolation structures, andsome bias contacts extend through isolation regions in a layer ofsemiconductor material. The positioning of bias contacts within a cellof an integrated circuit is related to the amount of space available forpositioning the bias contacts and the process window for manufacturingthe bias contact, namely thickness of the layer of semiconductormaterial selectivity of the etch process to the dielectric materials ofthe first ILD film, the semiconductor material exposed below the firstILD film, and the second oxide layer over the bias pad.

FIG. 4 is a cross-sectional view of an integrated circuit 400, inaccordance with some embodiments of the present disclosure. Inintegrated circuit 400, elements which have a similar function andstructure as the elements described above with regard to integratedcircuit 200 are given a same identifying reference numeral incrementedby 200, differences between integrated circuit 200 described above andintegrated circuit 400 are discussed below. In integrated circuit 200,the substrate 204 is electrically isolated from the interconnectionstructure of the integrated circuit. In integrated circuit 400, thesubstrate is electrically connected to the interconnection structure ofthe integrated circuit by a substrate contract 424. Substrate contact424 extends from a top surface of first ILD film down to the substrate404. In some embodiments, substrate contact 424 is against a top surfaceof substrate 404. In some embodiments, substrate contact 424 extendsdown into substrate 404. Substrate contact 424 is separated from thesemiconductor material in layer of semiconductor material 412 bydielectric material of DTI 422F and STI 420H. DTI 422F and STI 420H actas an insulating sleeve for substrate contact 424. Because substratecontact 424 is electrically isolated from bias contact 418C, substrate404 and bias pads 408B and 408C are configured for application of threeindependent voltages.

FIG. 5 is a cross-sectional view of an integrated circuit 500, accordingto some embodiments of the present disclosure. In integrated circuit500, elements of the integrated circuit which correspond to elements ofintegrated circuit 400 having a similar structure and/or function aregiven a same identifying reference numeral incremented by 100.Differences between integrated circuit 500 and integrated circuit 400are described below. In integrated circuit 500, bias contact 524 extendsfrom a top surface of first ILD film 514 down to substrate 504. Unlikesubstrate contact 424 in integrated circuit 400, which is electricallyisolated from layer of semiconductor material 412, substrate contact 524extends from a top surface of first ILD film 514 downward through layerof semiconductor material 512, second oxide layer 510, bias pad 508D,and first oxide layer 506, before reaching substrate 504. Bias contact524 is electrically isolated from bias contact 518C, and electricallyisolated from the transistors (first transistor 503A and secondtransistor 503B) by DTF 522F which is laterally separated from bothsubstrate contact 524 and bias contact 518C. In some embodiments, thesubstrate contacts are separated from bias pads, but also extend throughthe layer of semiconductor material. In some embodiments, the substratecontacts extend through the layer of semiconductor material, and thebias contacts extend through DTI structures acting as an insulatingsleeve. In some embodiments, all of the bias contacts and the substratecontacts extend through isolation structures and are separated from thelayer of semiconductor material.

FIG. 6A is a top view of an integrated circuit 600, in accordance withsome embodiments. In some embodiments, FIG. 6A corresponds to a singletransistor of a cell of an integrated circuit (see, e.g., firsttransistor 203A in FIG. 2, or second transistor 203B in FIG. 2). Inintegrated circuit 600, a cross-sectional line A-A′ extends throughisolation structures 604, cell area 602, isolation region 606, and abias contact 608. Isolation region 606 includes a plurality of biascontacts. Bias contacts 608 are pillar-type, or column-type biascontacts, having a columnar or cylindrical structure. Cell area 602 isthe portion of the layer of semiconductor material which includes sourcewells, drain wells, and channels for transistors of integrated circuit600. Isolation region 606 is a portion of the layer of semiconductormaterial which is isolated from the cell area 602 by isolation structure604.

FIG. 6B is a cross-sectional view of an integrated circuit 640 with astructure corresponding to the structure of integrated circuit 600,described above. Integrated circuit 640 includes a substrate 644, afirst oxide layer 646, a layer of bias pad material 648, a second oxidelayer 650, layer of semiconductor material 652, and a first ILD film654. Bias contact 658 extends downward through first ILD film 654,through isolation region 656 (corresponding to isolation region 606 inintegrated circuit 600), second oxide layer 650, before reaching biaspad 648A. Bias pad 648A extends below an entirety of the transistorwells 659 within DTI 662B (at one side of the transistor wells 659) andDTI 662C (at an opposite side of transistor wells 659). Bias contact 658is comparable to a contact such as bias contact 218B in FIG. 2,described above. In some embodiments, DTI 662A, 662B, and 662C formrings around a perimeter of, e.g., isolation region 606 and cell area602 (comparable to transistor wells 659), and follow an outline similarto the shape of isolation structure 604, as described above inconnection with FIG. 6A. Comparing integrated circuit 600 to integratedcircuit 640, isolation structure 604 in integrated circuit correspondsto shallow trench isolation structures and deep trench isolationstructures within the layer of semiconductor material 652, as follows:STI 660A and DTI 662A correspond to isolation structure 604 at a farside of isolation region 606 from cell area 602, STI 660B and DTI 662Bcorresponds to isolation region 604 between isolation region 606 andcell area 602, and STI 660 C and DTI 662C corresponds to isolationstructure 604 at a far side of cell area 602 from isolation region 606in integrated circuit 600.

FIG. 7A is a top view of an integrated circuit 700, in accordance withsome embodiments. Elements of integrated circuit 700 which have asimilar function to elements of integrated circuit 600 have a sameidentifying reference numeral incremented by 100. Cross-sectional lineB-B′ extends through integrated circuit 700 at a position similar to theposition of cross-sectional line A-A′ in integrated circuit 600. Thedifferences between integrated circuit 700 integrated circuit 600 aredescribed below. In integrated circuit 700, bias contact 708 is abar-type bias contact. Unlike the column-type bias contact 608 inintegrated circuit 600, bias contact 708 has a deep trench structurewhich is filled with electrically conductive material to convey anapplied electrical voltage to the bias pad transistor in the cell areaof the integrated circuit. In some embodiments, inclusion of a bar-typebias contact rather than a column type bias contact depends on a processwindow for manufacturing the bias contact. In embodiments of integratedcircuits where loading issues associated with etch processes for deepopenings for bias contacts are low priorities, bar-type contacts areincluded because of the greater amount of contact between the bias padand the interconnection structure of the integrated circuit. A bar typecontact has a greater amount of flexibility when positioning electricalconnections from the interconnection structure down to the bias contact.Column-type bias contacts general require greater precision in terms ofpositioning electrical connections to the column-type bias contacts, andhave more stringent process windows in order to ensure that thedimensions of the electrical connection to the column-type bias contactdo not increase electrical resistance between the interconnectionstructure and the bias pad below the cell area of the integratedcircuit.

FIG. 7B is a cross-sectional view of an integrated circuit 740 with astructure corresponding to the structure of integrated circuit 700,described above. Integrated circuit 740 includes a substrate 744, afirst oxide layer 746, a layer of bias pad material 748, a second oxidelayer 750, layer of semiconductor material 752, and a first ILD film754. Bias contact 758 extends downward through first ILD film 754,through isolation region 756 (corresponding to isolation region 606 inintegrated circuit 600), second oxide layer 750, before reaching biaspad 748A. Comparing integrated circuit 700 to integrated circuit 740,isolation structure 704 in integrated circuit corresponds to shallowtrench isolation structures and deep trench isolation structures withinthe layer of semiconductor material 752, as follows: STI 760A and DTI762A correspond to isolation structure 704 at a far side of isolationregion 706 from cell area 702, STI 760B and DTI 762B corresponds toisolation region 704 between isolation region 706 and cell area 702, andSTI 760 C and DTI 762C corresponds to isolation structure 704 at a farside of cell area 702 from isolation region 706 in integrated circuit700.

FIG. 8A is a top view of an integrated circuit 800, in accordance withsome embodiments. Cross-sectional line C-C′ extends through integratedcircuit 800 at a same position with which cross-sectional line A-A′extends through integrated circuit 600. Cross-sectional line C-C′extends through isolation structure 804A and isolation structure 804B,isolation region 806, cell area 802, and to bias contacts 808. Inintegrated circuit 800, bias contacts 808 are pillar-type bias contactssimilar to the bias contacts 608 in integrated circuit 600. Cell area802 is completely surrounded by isolation region 806. Isolationstructure 804A is completely surrounded by isolation region 806 withinthe layer of semiconductor material, between cell area 802 and isolationregion 806. Cell area 802 includes a portion of a layer of semiconductormaterial in which source wells, drain wells, and channel regions oftransistors are manufactured. Isolation region 806 includes a portion ofa layer of semiconductor material outside of the cell area through whichbias contacts and/or substrate contacts extend in order to makeelectrical connections between an interconnection structure of anintegrated circuit and bias pads or the substrate below cell area 802.

FIG. 8B is a cross-sectional view of integrated circuit 840, inaccordance with some embodiments. Elements of integrated circuit 840which have a same structure or function as elements of integratedcircuit 640 have a same identifying reference numeral incremented by200.

In integrated circuit 840, a substrate 844 has a first oxide layer 846deposited thereon. A layer of bias pad material 848 is over the firstoxide layer 846, and beneath a second oxide layer 850. A layer ofsemiconductor material 852 is between second oxide layer 850 and firstILD film 854. Bias contacts 808A and 808B extend through layer ofsemiconductor material 852 within isolation region 56. Isolation region856 is separated from cell area 802 by STI 860B and DTI 862B on a sideof cell area closest to bias contact 808A, and by STI 860D and STI 862Don a side of cell area 802 closest to bias contact 808B. Isolationregion 856 is separated from a remainder of layer of semiconductormaterial 852 by STI 860A and DTI 862A next to bias contact 808A, and bySTI 860C and DTI 862C next to bias contact 808B. Thus, cell area 802 issurrounded on all sides by dielectric material (second oxide layer 850on the bottom, STI and DTI structures within the layer of semiconductormaterial 852, and first ILD film 854 on a topside) having transistorcontacts extending therethrough. In integrated circuit 840, DTI 862Aextends through layer of semiconductor material 852, second oxide layer850, and layer of bias pad material 848, down to first oxide layer 846.DTI 862C extends through the film stack of integrated circuit 840 in amanner similar to DTI 862A. DTI 862A and DTI 862C include a buriedportion of isolation structure 804B in integrated circuit 800, andisolate bias pad 848A from the remainder of the layer of bias padmaterial 848.

FIG. 9 is cross-sectional view of an integrated circuit 900, inaccordance with some embodiments. Elements of integrated circuit 900which have a similar structure or function as elements of integratedcircuit 200 have a same identifying reference numeral incremented by700. Differences between the elements of integrated circuit 900 andintegrated circuit 200 are described below.

In integrated circuit 900, first transistor 903A and second transistor903B have different shaped bias pads. For first transistor 903A, secondoxide layer 910 has a first thickness 908, bias pad 908B has a bias padthickness 930B, and oxide layer 906 has a first oxide layer thickness930C. For second transistor 903B, second oxide layer 910 has a secondoxide layer thickness 932A smaller than second oxide layer thickness930A below first transistor 903A. For second transistor 903B, bias pad908C has a bias pad thickness 932B which is larger than bias padthickness 930B. Below second transistor 903B, first oxide layer 906 hasa first oxide layer thickness 932C. In integrated circuit 900, firstoxide layer thickness 930C is the same as first oxide layer thickness932C. Varying the thickness of the bias pad, or the thickness of thesecond oxide layer, below a transistor provides a manufacturer anopportunity to modify the strength of the electric field experienced bythe wells of the transistor as applied by the voltage transmitted to thebias pad by a biased contact. In some embodiments, the second oxidelayer has a same thickness (e.g., second oxide layer 930A and secondoxide layer 932A are the same thickness), and the first oxide layer hasdifferent thicknesses between different transistors. According to someembodiments, steps associated with reducing the thickness of the filmstack below a transistor are performed after deposition of the bias padmaterial and before deposition of the second oxide layer (such stepsbeing, among others, deposition of a layer of patterning material,transferring a pattern to the patterning material where openings in thepattern correspond to locations where the bias pad material is to bethinned, and etching away exposed portions of the bias pad materialusing liquid etchants or plasma etching). In order to provide a smoothand flat surface prior to deposition of the layer of semiconductormaterial the second oxide layer is deposited according to some versionsof method 140, such that a chemical mechanical polishing step isperformed in order to reduce the thickness of the second oxide layer toa value corresponding the smallest second oxide thickness (see, e.g.,the thickness of the second oxide layer 932A in FIG. 9) within a cell oracross a semiconductor wafer, without having bumps or an uneven topsurface of the second oxide layer.

FIG. 10 is a cross-sectional view of an integrated circuit 1000, inaccordance with some embodiments. Integrated circuit 1000 is similar tointegrated circuit 640, as described above in connection with FIG. 6B,but whereas FIG. 6B has a single bias pad 648A, integrated circuit 1000has two bias pads 1008B and 1008C by a DTI 1024, as further describedbelow. In integrated circuit 1000, a first cell 1001A and a second cell1001B meet at a cell boundary 1002A. Cell boundary 1002A extends throughDTI 1022A. Cell boundary 1002B extends through DTI 1022C. The film stackbelow transistor 1003 is as follows: a first oxide layer 106 isdeposited over a top surface of substrate 1004. A layer of bias padmaterial 1008 is deposited over a top surface of first oxide layer 1006.A second oxide layer 1010 is deposited over a top surface of the layerof bias pad material 1008. A layer of semiconductor material 1012 isdeposited over a top surface of second oxide layer 1010, and includesdoped wells for a transistor 1003. Shallow trench isolation structures(STI) extend through a top portion of layer of semiconductor material1012, but do not extend to the top surface of second oxide layer 1010.Deep trench isolation structures (DTI) have three versions. A firstversion of a DTI, DTI 1023A, DTI 1023B, and DTI 1023C, extends throughan entirety of the layer of semiconductor material 1012, down to secondoxide layer 1010. A second version of a DTI, DTI 1022A and DTI 1022C),extends through the layer of semiconductor material 1012, the secondoxide layer 1010, and the layer of bias pad material 1008, down to thefirst oxide layer 1006. The third version of a DTI, DTI 1024, extendsfrom second oxide layer 1010, through layer of bias pad material 1008,down to first oxide layer 1006. DTI 1024 does not extend through thelayer of semiconductor material 1012. DTI 1024 is entirely beneathtransistor 1003. DTI 1024 separates, the low transistor 1003, the layerof bias pad material 1008 into two separate bias pads, bias pad 1008Band bias pad 1008C. Bias contact 1018B, in the first cell 1001A, extendsthrough first ILD film 1014, the layer of semiconductor material 1012,and the second oxide layer 1010, down to bias pad 1008B. Bias contact1018C extends through first ILD film 1014, the layer of semiconductormaterial 1012, and second oxide layer 1010 down to bias pad 1008C.Because bias pad 1008B and bias pad 1008C are separated and electricallyisolated from each other by DTI 1024, bias pad 1008B and bias pad 1008Care configured to receive independent voltage setpoints beneathdifferent sides of transistor 1003. Thus, bias pad 1008B is configuredto apply a strong effect on P-doped source well 1012C, and bias pad1008C is configured to apply a strong effect against an-doped drain well1012 and N-type doped drift region 1012B below electrode 1014G. Biascontact 1018A in first cell 1001B is configured to receive anindependent voltage setpoints from bias contacts 1018B and 1018C, andbias pads 1008B and 1008C, in first cell 1001A.

FIGS. 11A-11H are cross-sectional views of an integrated circuit duringa manufacturing process, in accordance with some embodiments.

FIG. 11A is a cross-sectional view of an integrated circuit 1100 duringthe manufacturing process, in accordance with some embodiments. Inintegrated circuit 1100, a first cell 1101A is separated from a secondcell 1101B at a cell boundary 1102. For both first cell 1101A and secondcell 1101B, a first oxide layer 1106 is deposited over a substrate 1104.Deposition of the first oxide layer 1106 corresponds to operation 142 inmethod 140, described above. A layer of bias pad material 1108 isdeposited over first oxide layer 1106 in both the first cell 1101A andthe second cell 1101B. Deposition of the layer of bias pad material 1108corresponds to operation 146 in method 140, described above. A secondoxide layer 1110 is deposited over the layer of bias pad material 1108in both first cell 1101A and second cell 1101B. Deposition of the secondoxide layer corresponds to performance of operation 150 in method 140,described above. A layer of semiconductor material 1112 is depositedover the second oxide layer 1110 in both the first cell 1101A and thesecond cell 1101B. Deposition of the layer of semiconductor material1112 corresponds to performance of operation 154 in method 140,described above. Oxide layers are deposited over substrates by, e.g., avariation of chemical vapor deposition (CVD) wherein silane (SiH₄) andoxygen molecules react to form SiO₂ films on a top surface of asubstrate. The layer of semiconductor material 1112 is deposited by,e.g., CVD or epitaxial growth of the film using thermal decomposition ofsilane (SiH₄) or a silyl-halide (e.g., SiCl₄, SiBr₄, and so forth). Inembodiments wherein the layer of bias pad material 1108 is asemiconductor material, deposition occurs in a manner analogous to themanner of deposition of the layer of semiconductor material 1112. In anembodiment wherein the layer of bias pad material 1108 is a metalliclayer, the film deposition occurs by, e.g., sputtering of metal atomsfrom a metal target onto the first oxide layer 1106 to a thicknesssuitable for shielding a transistor from voltages in the substrate 1104.

FIG. 11B is a cross-sectional view of integrated circuit 1100 during amanufacturing process, according to some embodiments. In comparison toFIG. 11A, in FIG. 11B, a layer of patterning material 1113 has beendeposited over a layer of semiconductor material 1112. The layer ofpatterning material 1113 has been exposed and developed to form openings1123 therein. The blanket layers below the openings 1123 have beenetched to form openings (trenches) for deep trench isolation structureswhich are further described below for FIG. 11C. A first type of opening1121A extends through the layer of semiconductor material 1112 and stopagainst top surface of second oxide layer 1110. A short deep trenchisolation structure 1122A (a short DTI) is formed by filling of a firsttype of opening 1121A with a dielectric material (e.g., silicondioxide). A second type of opening 1121B extends through a layer ofsemiconductor material 1112, the second oxide layer 1110, and the layerof bias pad material 1108 to form isolated bias pads. A long deep trenchisolation structure 1122B (a long DTI) is formed by filling a secondtype of opening 1121B with a dielectric material. In some embodiments,the second type of opening 1121B extends down to the first oxide layer1106. In some embodiments, the second type of opening 1121B extends downinto the layer of bias pad material 1108, but not through to the firstoxide layer 1106. A depth of the second type of opening 1121B is relatedto at least the selectivity of the etch process for the layer of biaspad material with respect to the etch rate of the second oxide layer1110, and/or the layer of semiconductor material. In some embodiments,the depth of the second type of opening 1121B is also related to theprocess conditions for forming the second type of opening to achieve aprofile of the second type of opening which does not reduce the activearea of the cell below a circuit design specification.

FIG. 11C is a cross-sectional view of integrated circuit 1100 during amanufacturing process, in accordance with some embodiments of thepresent disclosure. In comparison to FIG. 11B, FIG. 11C includesisolation structure trenches, e.g., each of the first type of opening1121A, and the second type of opening 1121B, which have been filled witha dielectric material to form shallow DTIs 1122A and deep DTIs 1122B.After filling the openings with dielectric material, the wafer surfacewas planarized (by, e.g., chemical mechanical polishing (CMP)) to exposethe top surface of the layer of semiconductor material 1112 between thedifferent filled isolation structure trenches.

Long DTIs such as long DTI 1122B separate bias pads from each other. Forexample, bias pad 1108A in second cell 1101B is separated from bias pad1108B across cell boundary 1102, where long DTI 1122B is located at thecell boundary 1102. Bias pad 1108C is separated from bias pad 1108B by along DTI which separates PMOS transistor, or first transistor 1103A,from NMOS or second transistor 1103B. Another of second type of opening1121B separates bias pad 1108C from bias pad 1108D.

In FIG. 11C, a layer of patterning material 1121 has been added over atop surface of the layer of semiconductor material. A set of openings1123 in the layer of patterning material 1121 corresponds with locationsof shallow trench isolation structures (STI) in integrated circuit 1100.Patterning material portion 1121A masks active area 1112Y of the layerof semiconductor material 1112. Patterning material portion 1121B masksactive area 1112Z of the layer of semiconductor material 1112. Activeareas 1112Y and 1112Z are undoped in FIG. 11C because dopants are addedto the layer of semiconductor material after formation of STI(1120A-1120H) in the layer of semiconductor material 1112. In someembodiments, the STI at the top of a long DTI extend around an activearea of a cell. In FIG. 11C, therefore, STI 1120B and 1120E appear to bedifferent in a cross-sectional view of the first cell 1101A, but areactually a single STI which extends around the perimeter of active area1112Y and around the bias pad 1108B. Similarly, DTI 1122B and 1122Eextend around the perimeter of active area 1112Y and bias pad 1108B.Similarly, Bias pad 1108C and active area 1112Z are surrounded by asingle STI, shown as STI 1120E and 1120H, and by a single long DTI shownas DTI 1122D and 1122F (see also FIG. 6A, isolation structure 604, andFIG. 6B DTI 662A and 662C.

STI 1120A-1120H are formed oxidizing the top surface of the layer ofsemiconductor material. In some embodiments, an oxygen rich plasma isused to oxidize exposed upper portions of the layer of semiconductormaterial 1112 within the openings 1123 in the layer of patterningmaterial 1113. In some embodiments, an etch process is performed toremove an upper portion of the layer of semiconductor material 1112 fromthe bottom of the openings 1123, and the openings in the layer ofsemiconductor material are filled with dielectric material, andplanarized with a CMP process to expose the layer of semiconductormaterial.

In comparison to FIG. 11C, in FIG. 11D, the active areas 1112Y and 1112Zhave been implanted with P-type and N-type dopant atoms to form dopedregions 1112A-1112F for the active areas. For a first transistor 1103A,a PMOS transistor, P-doped well 1112A is separated from an N-doped well1112C by a P-doped drift region 1112B. STI 1120D separates the topsurface of P-doped well 1112A from the top surface of P-doped driftregion 1112B. No STI separates the top surface of P-doped drift region1112B from the top surface of N-doped well 1112C. For second transistor1103B, an NMOS transistor, an N-doped well 1112D is separated from aP-doped well 1112F by an N-doped drift region 1112E. An STI 1120Fseparates the top surface of N-doped well 1112D form the top surface ofN-doped drift region 1112E. No STI separates the top surface of theN-doped drift region 1112E from the top surface of P-doped well 1112F.The addition of doped regions in two different wells in the layer ofsemiconductor material 1112 corresponds to the performance of operation156 in method 140, described above. In some embodiments, steps which arealso part of operation 156 include steps of adding dopants forsource/drain regions, and/or LDD regions to the layer of semiconductormaterial 1112 as part of making the transistors (e.g., first transistor1103A and second transistor 1103B), as described below.

FIG. 11E is a cross-sectional view of integrated circuit 1100, inaccordance with some embodiments of the present disclosure. Incomparison to FIG. 11D, FIG. 11E depicts the formation of gate electrode1114G1, in first transistor 1103A, and gate electrode 1114G2, in secondtransistor 1103B. Gate electrodes 1114G1 and 1114G2 are formed bydepositing a blanket layer of gate dielectric material (not shown) overtop surface of the layer of semiconductor material 1112 and the STI1120A-1120H, and depositing a layer of gate electrode material (e.g.,polysilicon, silicon germanium, and so forth) over the layer of gatedielectric material (not shown). A layer of patterning material isdeposited over the layer of gate electrode material, and a patterntransferred thereto, before exposed portions of the layer of gatedielectric material and the gate electrode material are removed by anetch process to expose the layer of semiconductor material 1112, and theSTI 1120A-1120H, leaving gate electrodes 1114G1 and 1114G2 behind. Gateelectrode 1114G1 extends over part of the top surface of STI 1120D andover the top surface of P-doped drift region 1112B, and over part of thetop surface of N-doped well 1112C. Gate electrode 1114G2 extends overpart of a top surface of STI 1120F, over the top surface of N-dopeddrift region 1112E, and over part of the top surface of P-doped well1112F.

FIG. 11F is a cross-sectional diagram of an integrated circuit 1100during a manufacturing process, in accordance with some embodiments ofthe present disclosure. In FIG. 11F, LDD regions 1115A, 1115B, and 1115Chave been formed in first cell 1103A, and LDD regions 1115D, 1115E, and1115F have been formed in second cell 1103B, after formation of gateelectrodes (see, e.g., gate electrodes 1114G1 and 114G2, as described inconnection with FIG. 11D, above). LDD regions promote increased carrierdensity for the transistors and act as landing locations for transistorcontacts. According to some embodiments, the addition of LDD regions ofthe integrated circuit corresponds to performance of operation 156 inmethod 140. In some embodiments, dopants are added to the layer ofsemiconductor material using multiple doping operations, such as addingP-type dopants in a first dopant adding operation, and N-type dopants ina second dopant-adding operation. In some embodiments, dopants are addedby adjusting the energy of dopant atoms in an implant process. Lowerimplant energies are used in order to retain the implanted dopant atomsto the upper portion of the doped wells where the LDD regions arelocated. For example, LDD region 1115A is located in an upper portion ofP-doped well 1112A, and is physically separated form P-doped driftregion 1112B. Similarly, LDD regions 1115B and 1115C are located in anupper region of N-doped well 1112C, and are physically separated fromP-doped drift region 1112B. LDD region 1115A has a net P-type dopingprofile with a higher concentration of P-type dopants than P-doped well1112A. LDD 1115C has a net N-type doping profile, with a largerconcentration of N-type dopants than in N-doped well 1112C. LDD 1115Bhas a net P-type doping profile and adjoins a side of LDD 1115C withinN-doped well 1112C. LDD 1115B approaches, but does not extend below,gate 1114G1.

LDD 1115D is located in an upper region of N-doped well 1112D, and has ahigher concentration of N-type dopants than the N-doped well 1112Doutside the LDD region 1115D. LDD region 1115D is physically separatedfrom N-doped drift region 1112E. N-doped drift region is physicallyseparated from the LDD regions in the P-doped well 1112F: LDD 1115E and1115F. LDD 1115F is a P-doped LDD region in an upper region of P-dopedwell 1112F, and LDD 1115E is adjacent to LDD 1115F in the upper regionof P-doped well 1112F. LDD 1115E has a net N-type doping profile andseparates P-doped LDD 1115F from the portion of P-doped well 1112Fdirectly below gate electrode 1114G2 and the P/N junction directly belowgate electrode 1114G2.

When adding the dopants to the source/drain regions, or to one or moreLDD region, in the layer of semiconductor material, a layer ofpatterning material is deposited over a top surface of the layer ofsemiconductor material (and the DTIs extending through the layer ofsemiconductor material), exposing a portion of one or more doped wellswithin the footprint of a transistor. When adding a LDD regions such asLDD region 1115A in well 1112A, the local density of P-type dopants isincreased within the LDD region by addition of extra P-type dopants inan implant process. When forming LDD region 1115B in well 1112C, P-typedopants are added to first neutralize the net N-type dopant surplus inthe top region of well 1112C, and then produce a surplus or excess ofP-type dopants within the LDD region 1115B. Thus, according to someembodiments, the first quantity of dopants is added to LDD region 1115A,and a second quantity of P-type dopants is added to LDD region 1115B,where the second quantity of P-type dopants is larger than the firstquantity of the P-type of dopant because of the different composition ofthe wells where the LDD regions are located. In a similar fashion, theaddition of dopants to LDD region 1115D, located at a top region of well1112D, requires a smaller total quantity of N-type dopants than theaddition of N-type dopants to form LDD region 1115E in well 1112F ofsecond transistor 1103B. LDD region 1115C in well 1112C is formed byadding N-type dopants to the top region of the well 1112C. Similarly,the formation of LDD region 1115F in well 1112F occurs by adding P-typedopants to the top region of the well 1112F.

FIG. 11G is a cross-sectional view of integrated circuit 1100 during amanufacturing process, in accordance with some embodiments of thepresent disclosure. In comparison to FIG. 11F, FIG. 11G depicts aplurality of contacts which have been formed through the film stack ofintegrated circuit 1100. A first set of contacts, bias contacts 1118A,bias contact 1118B, and bias contact 1118C, extend through first ILDfilm 1114, the layer of semiconductor material 1112, and the secondoxide layer 1110, down to bias pads. Bias contact 1118A electricallyconnects to bias pad 1108A. Bias contact 1118B electrically connects tobias pad 1108B. Bias contact 1118C electrically connects to bias pad1108C. Bias pad 1108B is under an entirety of first transistor 1103A.Bias pad 1108C under an entirety of second transistor.

Transistor contacts for first transistor 1103A include drain transistor1116D, which electrically connects to LDD region 1115A, gate contact1116G, which electrically connect to gate electrode 1114G1, and sourcecontact 1116S1, which electrically connects to LDD regions 1115B and1115C in N-well 1112C of first transistor 1103A. Second transistor 1103Bhas drain transistor 1116D2 which extends through first ILD film 1114 toLDD region 1115D in N-doped well 1112D. Gate contact 1116 G2 extendsthrough first ILD film down to electrode 1114G2. Source contact 1116S2extends through first ILD film 1114 down to LDD region 1115E and LDDregion 1115F in well 1112F. According to some embodiments, bias contactsare manufactured in separate operations for pitching contact openingsand filling the contact openings. The formation of transistor contactsand bias contacts corresponds with the performance of operation 164 inmethod 140, as described above.

FIG. 11H is a cross-sectional view of integrated circuit 1100, inaccordance with some embodiments. In comparison to FIG. 11G, FIG. 11Hdepicts a first portion of an interconnection structure betweencontacts. A conductive line 1124A extends across a top surface of thefirst ILD film 1117 from bias contact 1118B to drain contact 1116D1 infirst transistor 1103A. Similarly, conductive line 1124B extends fromsource contact 1116S2 in second transistor 1103B to bias contact 1118C.Thus, operation of a transistor triggers both the movement of carriersthrough the channel region between the source and drain transistor andthe application of a voltage, or the storage of charge, in a bias padbeneath the transistor as the transistor operates. The conductive lines1124A and 1124B serve as bridges to promote the operation of the biaspads without additional transistors or logical elements in an integratedcircuit. Conductive lines 1124A and 1124B are within an ILD layer 1119deposited over ILD layer 1117.

FIGS. 12A-12D are cross-sectional views of an integrated circuit duringa manufacturing process, in accordance with some embodiments.

FIG. 12A is a cross-sectional view of an integrated circuit 1200, inaccordance with some embodiments of the present disclosure. Inintegrated circuit 1200, the first oxide layer 1206 has been depositedover a substrate 1204. In integrated circuit 1200, a first cell 1201A isundergoing first oxide layer thinning, while a second cell 1201B of theintegrated circuit is protected from first oxide layer thinning by alayer of masking material 1205. Must material 1205 has been depositedover a top surface of first oxide layer 1206. In first cell 1201A, afirst top surface portion 1206T1 and a second top surface portion 1206T2are exposed by openings in masking material 1205. First top surfaceportion 1206T1 corresponds to first transistor 1203A. Second top surfaceportion 1206T2 corresponds to a part of the oxide layer below secondtransistor 1203B. First oxide layer thinning occurs by etching first topsurface portion 1206T1 and second top surface portion 1206T2 by anetching process, as previously described in optional operation 144 ofmethod 140.

FIG. 12B is a cross-sectional view of an integrated circuit 1220, inaccordance with some embodiments. Elements of integrated circuit 1220which have a similar structure and function as integrated circuit 1200,as described in FIG. 12A, of a same identifying numeral. Differencesbetween integrated circuit 1220 and integrated circuit 1200 aredescribed below. In integrated circuit 1220, only first transistor 1203Ahas been exposed first top surface portion 1206T1 for first oxidethinning according to operation 144 of method 140, as described above.The first oxide layer 1206 for second transistor 1203B is protected fromfirst oxide thinning by masking material 1205.

FIG. 12C is a cross-sectional view of integrated circuit 1240, inaccordance with some embodiments of the present disclosure. Inintegrated circuit 1240, elements which have a similar structure andfunction as integrated circuit 1200 a same identifying numeral. A layerof bias pad material 1208 has been deposited over first oxide layer1206. A layer of masking material 1207 has been deposited over the layerof bias pad material 1208. Openings in the layer of masking material1207 corresponds to bias layer material portions 1208T1 and 1208T2 forfirst transistor 1203A and second transistor 1203B. Thinning of thelayer of bias pad material 1208 is performed according to optionaloperation 148 as described above in method 140. Generally, thinning oflayers of bias pad material is performed by etching with aqueousetchants or a dry, or plasma etch process. Further details about thechemistry and other considerations associated with bias layer thinningare described previously in operation 148 of method 140.

FIG. 12D is a cross-sectional view of an integrated circuit 1260, inaccordance with some embodiments of the present disclosure. Elements ofintegrated circuit 1260 which have a similar structure or function aselements of integrated circuit 1240 have a same identifying reference.Masking material 1207 is over the layer of bias pad material 1208.Masking material 1207 covers the layer of bias pad material 1208 in theregion of sections at 1203B, but an opening in masking material in 1207exposes bias layer material portions 1208T1 in the footprint of thefirst transistor 1203A. In accordance with some embodiments, the layerof bias pad material below PMOS transistors in an integrated circuitcell exposed for thinning, while in most transistor is protected by themasking material. In some embodiments, the layer of bias pad materialbelow NMOS transistors is exposed for thinning while PMOS transistorsare protected by the masking material.

An aspect of the present disclosure relate to a method of making anintegrated circuit, which includes operations of surrounding a firstbias pad with dielectric material of a buried oxide layer; addingdopants to a layer of semiconductor material over the first bias pad;depositing a gate dielectric and a gate electrode material over a topsurface of the layer of semiconductor material; etching the gatedielectric and the gate electrode material to isolate a gate electrodeover the layer of semiconductor material; depositing an inter layerdielectric (ILD) material over the gate electrode and the layer ofsemiconductor material; etching at least one bias contact opening downto the first bias pad; filling the at least one bias contact openingwith a bias contact material; electrically connecting at least one biascontact to an interconnect structure of the semiconductor device. Insome embodiments of the method, surrounding the first bias pad withdielectric material of the buried oxide layer further includesdepositing a first oxide layer over a substrate; depositing a layer ofbias pad material over the first oxide layer; depositing a second oxidelayer over the layer of bias pad material; and isolating the first biaspad from a remainder of the layer of bias pad material by etching a deeptrench isolation structure opening through the second oxide layer andthe layer of bias pad material, and filling the deep trench isolationstructure opening with a dielectric material, wherein a deep trenchisolation structure extends around a portion of the layer ofsemiconductor material. In some embodiments, adding dopants to the layerof semiconductor material further includes adding dopants to a sourcewell and a drain well of the transistor, and further comprises etchingsubstrate contact openings from the first ILD film down to thesubstrate, and filling the substrate contact openings with a conductivematerial. In some embodiments, the method further includes surrounding asecond bias pad within the buried oxide layer with dielectric material,the second bias pad being below a different transistor than the firstbias pad. In some embodiments, the first bias pad has a first bias padthickness, and the second bias pad has a second bias pad thickness, andthe method further includes modifying the first bias pad thickness to bedifferent from the second bias pad thickness.

An aspect of the present disclosure relates to a method of making asemiconductor device. The method includes manufacturing a bias layerover a buried oxide layer. The method further includes growing a layerof semiconductor material over the bias layer. The method furtherincludes forming a transistor in the layer of semiconductor material,wherein the bias layer is between the transistor and a substrate. Themethod further includes forming a first deep trench isolation structure(DTI) extending through the layer of semiconductor material andcontacting the substrate. The method further includes forming a firstbias contact extending through the layer of semiconductor material andelectrically connecting to the bias layer. In some embodiments, themethod further includes forming a dielectric layer over the bias layer,wherein growing the layer of semiconductor material comprises growingthe layer of semiconductor material over the dielectric layer. In someembodiments, the method further includes manufacturing a second biaslayer over the buried oxide layer, wherein the second bias layer isspaced from the bias layer in a direction parallel to a top surface ofthe substrate. In some embodiments, the method further includes forminga second bias contact extending through the semiconductor layer andelectrically connecting to the second bias layer. In some embodiments,forming the second bias contact includes forming the second bias contacton an opposite side of the transistor from the first bias contact. Insome embodiments, the method further includes forming the second biascontact comprises forming the second bias contact on a same side of thetransistor as the first bias contact. In some embodiments, forming thefirst DTI includes forming the first DTI between the bias layer and thesecond bias layer. In some embodiments, the method further includesforming a second DTI between the bias layer and the second bias layer.In some embodiments, forming the second DTI includes forming the secondDTI underneath the transistor. In some embodiments, forming thetransistor includes forming a well region in the layer of semiconductormaterial, wherein the well region partially overlaps the bias layer.

An aspect of the present disclosure relates to a method of making asemiconductor device. The method further includes manufacturing a biaslayer over a buried oxide layer. The method further includes growing alayer of semiconductor material over the bias layer. The method furtherincludes forming a transistor in the layer of semiconductor material,wherein the bias layer is between the transistor and a substrate. Themethod further includes forming a first deep trench isolation structure(DTI) extending through the layer of semiconductor material andcontacting the substrate. The method further includes forming a contactextending through the DTI to contact the substrate, wherein the contactis separated from the bias layer. In some embodiments, the methodfurther includes forming a bias contact extending through the layer ofsemiconductor material and electrically connecting to the bias layer. Insome embodiments, forming the bias contact includes forming the biascontact on an opposite side of the transistor from the contact. In someembodiments, forming the bias contact includes forming the bias contacton a same side of the transistor as the contact. In some embodiments,the method further includes manufacturing a second bias layer over theburied oxide layer, wherein the second bias layer is between the biaslayer and the contact.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of making a semiconductor device, comprising: surrounding a first bias pad with dielectric material; adding dopants to a layer of semiconductor material over the first bias pad; depositing a gate dielectric and a gate electrode material over a top surface of the layer of semiconductor material; etching the gate dielectric and the gate electrode material to isolate a first gate electrode over the layer of semiconductor material; depositing an inter layer dielectric (ILD) material over the first gate electrode and the layer of semiconductor material; etching at least one bias contact opening down to the first bias pad; filling the at least one bias contact opening with a bias contact material; and electrically connecting at least one bias contact to an interconnect structure of the semiconductor device.
 2. The method of claim 1, wherein surrounding the first bias pad with dielectric material further comprises: depositing a first oxide layer over a substrate; depositing a layer of bias pad material over the first oxide layer; depositing a second oxide layer over the layer of bias pad material; isolating the first bias pad from a remainder of the layer of bias pad material by etching a deep trench isolation structure opening through the second oxide layer and the layer of bias pad material, and filling the deep trench isolation structure opening with a dielectric material, wherein a deep trench isolation structure extends around a portion of the layer of semiconductor material.
 3. The method of claim 1, wherein adding dopants to the layer of semiconductor material further comprises: adding dopants to a source well and a drain well of a transistor; etching substrate contact openings from the first ILD material down to the substrate; and filling the substrate contact openings with a conductive material.
 4. The method of claim 1, wherein etching the gate dielectric and the gate electrode material further comprises isolating a second gate electrode over the layer of semiconductor material, and further comprising surrounding a second bias pad with dielectric material, the second bias pad being below the second gate electrode.
 5. The method of claim 4, wherein the first bias pad has a first bias pad thickness, and the second bias pad has a second bias pad thickness, and the method further comprising modifying the first bias pad thickness to be different from the second bias pad thickness.
 6. A method of making a semiconductor device, the method comprising: manufacturing a bias layer over a buried oxide layer; growing a layer of semiconductor material over the bias layer; forming a transistor in the layer of semiconductor material, wherein the bias layer is between the transistor and a substrate; forming a first deep trench isolation structure (DTI) extending through the layer of semiconductor material and contacting the substrate; and forming a first bias contact extending through the layer of semiconductor material and electrically connecting to the bias layer.
 7. The method of claim 6, further comprising forming a dielectric layer over the bias layer, wherein growing the layer of semiconductor material comprises growing the layer of semiconductor material over the dielectric layer.
 8. The method of claim 6, further comprising manufacturing a second bias layer over the buried oxide layer, wherein the second bias layer is spaced from the bias layer in a direction parallel to a top surface of the substrate.
 9. The method of claim 8, further comprising forming a second bias contact extending through the semiconductor layer and electrically connecting to the second bias layer.
 10. The method of claim 9, wherein forming the second bias contact comprises forming the second bias contact on an opposite side of the transistor from the first bias contact.
 11. The method of claim 9, wherein forming the second bias contact comprises forming the second bias contact on a same side of the transistor as the first bias contact.
 12. The method of claim 8, wherein forming the first DTI comprises forming the first DTI between the bias layer and the second bias layer.
 13. The method of claim 8, further comprising forming a second DTI between the bias layer and the second bias layer.
 14. The method of claim 13, wherein forming the second DTI comprises forming the second DTI underneath the transistor.
 15. The method of claim 6, wherein forming the transistor comprises forming a well region in the layer of semiconductor material, wherein the well region partially overlaps the bias layer.
 16. A method of making a semiconductor device, the method comprising: manufacturing a bias layer over a buried oxide layer; growing a layer of semiconductor material over the bias layer; forming a transistor in the layer of semiconductor material, wherein the bias layer is between the transistor and a substrate; forming a first deep trench isolation structure (DTI) extending through the layer of semiconductor material and contacting the substrate; and forming a contact extending through the DTI to contact the substrate, wherein the contact is separated from the bias layer.
 17. The method of claim 16, further comprising forming a bias contact extending through the layer of semiconductor material and electrically connecting to the bias layer.
 18. The method of claim 17, wherein forming the bias contact comprises forming the bias contact on an opposite side of the transistor from the contact.
 19. The method of claim 17, wherein forming the bias contact comprises forming the bias contact on a same side of the transistor as the contact.
 20. The method of claim 17, further comprising manufacturing a second bias layer over the buried oxide layer, wherein the second bias layer is between the bias layer and the contact. 